Dicing Blade

  • High Precision Electroformed(EF) Blade
  • High Precision Vitrified Blade
  • High Precision Metal Blade
  • High Precision Resin Blade
  • High Precision Hub Blade

Electroformed Bond Blade

Accomplishment of high cutting ability with multi-pore bond characteristic Various choice of bond type

MYTECH's very own developed electroformed bond blade for dicing or grooving process.
A wide selection of bond types available for different kinds of application use.

Applications -FR-4
-Ceramic
-MLCC
-GMR head
-SAW filter
etc.

Characteristics
-Ultra thin
-High rigidity
-Wear-resistant

Available for customized or special type of blades
Cost reduction approach

*Colors of the image are different from the real products.

Standard Specification

Example: 20/30AA 56D / 0.1T / 40H / 1w / 2d / 16N
Grit Size Bond Name O.D. Thickness I.D. Slit Width Slit Depth Slit Numbers
20/30 AA 56D 0.1T 40H 1w 2d 16N

Standard Grit Size

Grit SizeMesh Size
40/60#400
30/40#500
20/30#600
12/25#700
10/20#800
8/20#900
8/16#1000
6/12#1200
5/10#1500
4/8#2000
4/6#2500
3/5#3000
2/6#3500
2/4#4000

Bond Type

Bond NameHardness
AAHard

Soft
BC
CA
DA
DH
DM
SCSpecial

*The bond showed above is only the representitive types.
Customized hardness of bond type is available.

Available Size and Tolerance

ItemRangeTolerance
O.D. < φ140mm +0.02 -0
I.D. < φ100mm H6
Thickness 0.025〜0.3mm< 0.3mm±0.01
< 0.1mm±0.005
< 0.05mm ±0.002
SlitWidthDepth Numbers
0.5mm 1mm 2mm 5mm1mm 2mm8N 16N 32N 64N

Vitrified Bond Blade

Porous type
Realizes high quality process on hardened materials like Sapphire

VWith high rigidity and cutting capability, vitrified bond blade is able to keep the straightness on the entry and exit point and precision of work dimension during high-loading process.

Applications
-Sapphire
-Alumina
-CSP
-Glass
etc.

Characteristics
-High cutting capability (compared with Electroformed bond type)
-Long life (compared with Resin bond type)
-Electrical conductivity
-Applicable to hardened and compound materials

Available for customized blade
Cost performance approach

*Colors of the image are different from the real products.

Standard Specification

Example: SD600J25N01 56D / 0.1T / 40H
Grain Grit Size Hardness Conc. Bond Name O.D. Thickness I.D.
SD 600 J 25 N01 56D 0.1T 40H

Standard Grit Size

Grid Size Mesh Size
#200
-#230
-#270
-#325
40/60#400
30/40#500
20/30#600
10/20#800
8/16#1000
6/12#1200
5/10#1500
4/8#2000
2/6#3000

Bond Type

Grit TypeHardness Bond TypeConcentration
SD
CBN
G~SN01~N1020~125

With our own unique techniques, Vitrified Bond Blade is electrical conductivity available and alone with a very wide range of hardness choices.

Available Size and Tolerance

ItemRangeTolerance
O.D. < φ125mm ±0.02
I.D.88.9H, 40H, 25.4HH7
Thickness0.07~0.6mm±0.005

Metal Blade

A wide selection of bonds available for various applications

Metal bond blade, with higher wear-resistance and higher stiffness, can effectively reduce cutting defects while providing very long blade life.

Applications
-CSP
-Glass
-MLCC
-GMR head
-CMOS
etc.

Characteristics
-Ultra thin (over 45um)
-High stiffness
-Wear-resistant
-High quality

Available for customized or special type of blades

*Colors of the image are different from the real products.

Standard Specification

Example: SD600-25MH
Grain Grit Size Conc. Name O.D. Thickness I.D.
SD 600 25 MH 56D 0.15T 40H

Standard Grit Size

Grid Size Mesh Size
2/6#3000
4/8#2000
5/10#1500
6/12#1200
8/16#1000
10/20#800
12/25#700
20/30#600
30/40#500
40/60#400
-#325
-#270
-#230
-#200
-#170

Bond Type

Grit TypeBond TypeConcentration
SD
CBN
MH15~125
MS
M43
M18
MQ

There are more types for Resin bond other then the ones listed above. Also, customized bond development is available.

Metal Blade Size and Tolerance

Item Range Tolerance
O.D. < φ110mm +0.02, -0
I.D. 88.9H/55H/40H, 25.4HH6
Thickness0.05~0.5mm±0.005

Resin Bond Blade

High cutting perfomance with diversified line-up on various applications

With the characteristic of vertical consumption and self-sharpening, resin bond blade can efficiently reduce the occurence of grain deformation and improve the cutting quality and efficiency.

Applications
-CSP
-Glass
-CMOS
-Ceramic
etc.

Characteristics
-Ultra thin (over 50um)
-Chipping improvement
-High cutting capability

Available for customized or special type of blades
Cost reduction approach

*Colors of the image are different from the real products.

Standard Specification

Example: SD600-25-BA 56D / 0.1T / 40H
Grain Grit Size Conc. Bond name O.D. Thickness I.D.
SD 600 25 BA 56D 0.1T 40H

Standard Grit Size

Grit Size Mesh Size
2/6#3000
4/8#2000
5/10#1500
6/12#1200
8/16#1000
10/20#800
12/25#700
20/30#600
30/40#500
40/60#400
-#325
-#270
-#230
-#200
-#170

Bond Type

Grit Type Bond TypeConcentration
SD
SDC
CBN
BA15~125
BB
BQ
BS

There are more types for Resin bond other then the ones listed above. Also, customized bond development is available.

SR Blade Size and Tolerance

Item Range Tolerance
O.D. < φ125mm ±0.02
I.D. 88.9 H, 40H, 25.4HH7
Thickness0.05~0.1mm OD φ50~φ90 +0.01, -0.005
0.11〜0.5mm±0.01
0.1〜0.5mmOD φ91~φ125±0.015

Hub Blade

Hub blade is deployed on silicon wafer and compound semiconductor wafer cutting.

Applications
-Si
-SiC
-Compound semiconductors
etc.

Characteristics
-Ultra thin
-Back side chipping improvement

Available for special type and low concentration of blades
Cost reduction approach

*Colors of the image are different from the real products.

Standard Specification

Example: 0103-HH T15-E3-70
Grit Size Bond Thickness Exposure Conc.
0103 HH T15 E3 70
Grit Size
0003 5000
0103 4800
0204 4000
0206 3500
0305 3000
0406 2000
0408 1700
Exposure[mm]
E3 Middle
E50.510-0.640
E60.640-0.760
E70.760-0.890
E90.890-1.020
E101.020-1.150
Blade Thickness
[mm]
Applied Exposur
T150.015E3
T200.020E3/E5/E6
T250.025E5/E6/E7
T300.030E5/E6/E7/E9
T350.035E5/E6/E7/E9/E10
T400.040E6/E7/E9/E10
T450.045E6/E7/E9/E10
T500.050E6/E7/E9/E10
T550.055E7/E9/E10
T600.060E7/E9/E10
Bonding Spec.
HHHardall grit size available
HSMiddleall grit size available
HLSoftAll grit size available other than 0103
HXSpecialall grit size available
Low concentration
130-110High
110-90Middle High
90-70Middle
70-50Middle Low
50-30Low
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