GRINDING WHEEL

GRINDING WHEEL

Vitrified Wheel for Sapphire grinding

1.High self –sharping, Non-dressing
Usually, Sapphire wafer grinding process needs to do dressing very often.
In particular, it need to do dressing every single wafer.
But our special vitrified bonded grinding wheel can continue grind without any dressing during processing.
2.You can grind the wafer with very high speed feed rate
You will be realized high performance of sharpness of Wheel.
SD270VT/SD325VT wheel made by Mytech can feed 500um/min and it can shorten processing time very much
3.The ratio to grinding of SD270VT and SD325VT is less than 10%
Our special bonding recipe can reach less than 10% of wear resistance.
You can save your machine idling time and grinding process cost.
4. It is able to customized the wheel spec and dimension every customer and machine.
It is required the high torque of spindle and the rigidity of equipment for the grinding of Sapphire wafer.
It necessary to choose appropriate bond spec depend on the machine type.
We are able to offer the best grinding wheel for your machine and processing.
We have 3w/4w/5w and Long chip type for improve the wear resistance.
You can choose the most suitable spec wheel from our various type of spec.
GRINDING WHEEL

Grinding process of the outline

Grinding process of the outline
SEM picture of Vitrified boding surface

SEM picture of Vitrified boding surface

General processing condition

ItemGrinding
ProcessRough GrindingMiddle GrindingFine Grinding
WheelVT#270/VT#325VT#800/V#1000VT#1500/VT#2000
Recommend
grinding
Condition
Spindle rpm: 1200 rpm
Table rpm: 200rpm
Feed: 200um-600um/min
End Spark-out: 10sec
Removal: 50um‐800um
Spindle rpm: 800 rpm
Table rpm: 200rpm
Feed: 15um/min
End Spark-out: 10sec
Removal: 30um-50um
Spindle rpm: 400 rpm
Table rpm: 200rpm
Feed: 10um/min
End Spark-out: 10sec
Removal: 15um

Depends on you target thickness and roughness, you can choose grit size or we can recommend the process.

Surface finishing with each grit size

Grit sizeRoughness(Ra)TTV
VT#270500nm1-2um
VT#325400nm1-2um
VT#800150nm1-2um
VT#1000100nm1-2um
VT#150050nm1-2um
VT#200020nm1-2um

Roughness after grind by VT325 (4”Wafer)

 

Roughness after grind by VT800 (4”Wafer)

Roughness after grind by VT1500 (6”Wafer)

 

Roughness after grind by VT2000 (4”Wafer)

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